Thursday and Friday, July 20-21
Embassy Suites Chicago – Downtown/Lakefront (in person)
Registration closes on Monday, March 27; link below
Loyola University Chicago School of Law is hosting the 2023 Patent Law Interview Program on Thursday and Friday, July 20-21. This nationwide interview program targets patent law employers and rising 2L/3L-PT and 3L/4L-PT students. The 2023 Patent Law Interview Program will be held IN PERSON* at the Embassy Suites Chicago – Downtown/Lakefront. Registration closes on Monday, March 27 (see more details below). Please be mindful of the deadline as late registrations are not accepted.
Students with undergraduate or graduate degrees in engineering or a technical science should consider registering for the program. You do not need to be patent bar eligible to register, although the vast majority of employers participating in the program are seeking patent bar eligible students. For more information on eligibility for the patent bar, please refer to the General Requirements Bulletin from the U.S. Patent and Trademark Office.
Last year roughly 150 employers, 190 law schools, and 1,300 law students from across the country participated in the program. The program is entirely pre-selected, which means that students submit application materials to apply to interviews with the employers they are interested in, and employers then review their materials and select the students they wish to interview at the program. Last year, approximately half of the participating students were selected for interviews. Typically, all of the participating employers are interested in interviewing rising 2L/3L-PT students at the Patent Program. Only around 25% of the participating employers are interested in interviewing rising 3L/4L-PT students.
For more information on the program, please refer to the Loyola Patent Program website at: https://www.luc.edu/law/currentstudents/careerservices/patentprogram/.
Online student registration for this year’s Patent Law Interview Program is OPEN NOW and will close on Monday, March 27. Students can register at: https://epay.luc.edu/C20996_ustores/web/store_main.jsp?STOREID=311&SINGLESTORE=true
At this stage of registration, you will only need to enter some basic information. However, this is just the first step in participating in the program: After student registration ends, you will receive information about how to register in PIPER, upload your application materials, and apply to participating law firms.
There is a non-refundable $50 dollar registration fee that you must pay by credit card to complete your online registration. Please have your credit card ready when you register. Note: Denver Law will reimburse this fee to students who actually attend the interview program, after their return in July. All other costs are the responsibility of the student.
Once you have registered, the Loyola program staff will communicate with you directly via email to the address that you entered when registering for the program. Please direct any general questions about the program to the Patent Program Liaison in our Denver Law CDO office, Linton Wright (firstname.lastname@example.org).
The 2023 Patent Law Interview will accept registrations from the following students:
- JD students graduating in May/June 2024 (rising 3Ls)
- JD students graduating in May/June 2025 (rising 2Ls)
- JD students graduating in December 2023/January 2024 (rising 3Ls)
- JD students graduating in December 2024/January 2025 (rising 2Ls)
Students who will graduate before the program is held in July 2023, and students who plan to graduate after May/June 2025, are not eligible for the 2023 Patent Law Interview Program and should not register. Dual degree students should use the date that they will complete both of their degrees as their anticipated graduation date.
*Should Loyola or the City of Chicago change its COVID guidelines to require a remote program, we will notify you of any changes. The program will follow the safety protocols required by Loyola University Chicago for off-campus events: Loyola Health and Safety Information.